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| Product Name: |
PCB Assembly
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| Specifications |
PCB Assembly |
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"Flex, rigid flex, and rigid PCB form factors
SMT, through-hole, and mixed technology
Board sizes up to 18�x 14�
Complex, high density assemblies
PBGA, CBGA, TBGA, FPGA, CGA, LGA
Package on Package (PoP) assembly
Micro BGA (0.4mm)
0402s, 0201s, 01005s
Wave and selective solde
http://www.hemeixinpcb.com
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| Company: |
Hemeixin Electronics Co.,Ltd
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| Contact: |
Mr. wang li |
| Address: |
South of 5th Floor, Building 7,Wanxia Industrial Park, Tongfuyu Industrial Area, Shajing Town, Baoan District, Shenzhen,China |
| Postcode: |
85235 |
| Tel: |
86-0755-27586529 |
| Fax: |
86-0755-27934435 |
| E-mail: |
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